26 Patents
- US125989852026Semiconductor Structure and Forming Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US123226942025Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123158432025Hybrid Bonding Technology for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123006692025Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122835642025Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122782502025Semiconductor Device Including Image Sensor and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122305542025Shield Structure for Backside Through Substrate Vias (tsvs)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122181062025Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122181652025Semiconductor Image Sensor and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122058682025Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120339192024Backside or Frontside Through Substrate via (TSV) Landing on Metal
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119964292024CMOS Image Sensor Structure with Microstructures on Backside Surface of Semiconductor Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119554282024Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US119423682024Through Silicon Vias and Methods of Fabricating Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118625352024Through-substrate-via with Reentrant Profile
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118549592023Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117641292023Method of Forming Shield Structure for Backside Through Substrate Vias (TSVS)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117568622023Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569202023Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569362023Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117054492023Through Silicon via Design for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116949972023Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116463082023Through Silicon via Design for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites