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Inventors
Hsin-hao Huang
Kaohsiung
TW
7 patents
7 Patents
US12412825
2025
Semiconductor Package
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US12399858
2025
Method and Device for Reducing Latency in a Peripheral Component Interconnect Express Link
MEDIATEK Inc.
0 cites
US11874545
2024
Manufacturing Method of Electronic Device
Innolux Corporation
0 cites
US11812554
2023
Layout Structure of a Flexible Circuit Board
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US11645953
2023
Method for Manufacturing Flexible Display Device
Innolux Corporation
0 cites
US11606860
2023
Flexible Circuit Board
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US11581283
2023
Flip Chip Package and Circuit Board Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites