Hsien-wen Liu

10 Patents

• US123811802025

  Multi-chip Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123825872025

  Methods and Systems for Improving Surface Mount Joinder

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123346542025

  Network Communication Device with Antenna Frame

  Sercomm Corporation

  0 cites
• US122058532025

  Integrated Circuit Test Method and Structure Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US121989962025

  Integrated Fan-out Package, Package-on-package Structure, and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121130252024

  Semiconductor Package with Dual Sides of Metal Routing

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120093162024

  Semiconductor Structure and Method of Manufacturing a Semiconductor Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US117988982023

  Package Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US117569282023

  Multi-chip Packages

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116887282023

  Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites