Hsien-ming Tu

6 Patents

• US123226962025

  Dual-mode Wireless Charging Device

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US122781992025

  Conductive Bump of a Semiconductor Device and Fabricating Method Thereof Cross Reference to Related Applications

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US122611262025

  Semiconductor Package

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119233182024

  Method of Manufacturing Semiconductor Package

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118375622023

  Conductive Bump of a Semiconductor Device and Fabricating Method Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US117355182023

  Dual-mode Wireless Charging Device

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites