Hsieh-shen Hsieh

3 Patents

• US125371272026

  Magnetic Component Structure with Thermal Conductive Filler

  CYNTEC CO., Ltd.

  0 cites
• US117696212023

  Inductor with an Electrode Structure

  CYNTEC CO., Ltd.

  0 cites
• US117105952023

  Magnetic Component Structure with Thermal Conductive Filler and Method of Fabricating the Same

  CYNTEC CO., Ltd.

  0 cites