Patents/Inventors

Hsiao Lu Chen

Zhunan TownshipTW2 patents

3 Patents

US125937332026
Vertical Light Emitting Diode Die Packaging Method
INGENTEC CORPORATION
0 cites
US124179642025
Via-filling Method of Through-glass via Substrate
INGENTEC CORPORATION
0 cites
US124180112025
Bonding and Transferring Method for Die Package Structures
INGENTEC CORPORATION
0 cites