26 Patents
- US125640452026Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125387732026Semiconductor Structure Having Self-aligned Conductive Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124827032025Semiconductor Device Having Thermally Conductive Air Gap Structure and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124631342025Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124313862025Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124314262025Semiconductor Interconnection Structures Comprising a Resistor Device and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124244852025Semiconductor Structure with Air Gap and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124128042025Semiconductor Structure with Improved Heat Dissipation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123879282025Method for Manufacturing Semiconductor Structure with Material in Monocrystalline Phase
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123344312025Semiconductor Interconnection Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122725972025Semiconductor Interconnection Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122495552025Semiconductor Device Package Including a Thermal Conductive Layer and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121659452024Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121548502024Semiconductor Interconnection Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120947642024Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120948152024Semiconductor Structure Having Dielectric-on-dielectric Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120806502024Interconnect Structure with Low Capacitance and High Thermal Conductivity
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120740842024Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120681932024Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120625722024Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120027492024Barrier and Air-gap Scheme for High Performance Interconnects
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119232432024Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549632023Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118481982023Method for Manufacturing Semiconductor Device Having Low-k Carbon-containing Dielectric Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116580922023Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116409282023Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites