Hsiang-fan Lee

4 Patents

• US121659902024

  Semiconductor Device

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US119617792024

  3DIC Packaging with Hot Spot Thermal Management Features

  Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).

  0 cites
• US119160232024

  Thermal Interface Material Having Different Thicknesses in Packages

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115878862023

  Semiconductor Device

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites