Patents/Inventors

Hsiang An Feng

Zhunan TownshipTW4 patents

4 Patents

US125937332026
Vertical Light Emitting Diode Die Packaging Method
INGENTEC CORPORATION
0 cites
US124179642025
Via-filling Method of Through-glass via Substrate
INGENTEC CORPORATION
0 cites
US124180112025
Bonding and Transferring Method for Die Package Structures
INGENTEC CORPORATION
0 cites
US117698612023
Light-emitting Diode Packaging Structure and Method for Fabricating the Same
Ingentec Corporation
0 cites