Howard E. Chen

10 Patents

• US125885552026

  Dual Sided Molded Package with Varying Interconnect Pad Sizes and Varying Exposed Solderable Area

  Skyworks Solutions, Inc.

  0 cites
• US125820132026

  Configurations for Metal Posts for Dual Side Mold Modules

  Skyworks Solutions, Inc.

  0 cites
• US124314452025

  Methods Related to Dual-sided Module with Land-grid Array (LGA) Footprint

  Skyworks Solutions, Inc.

  0 cites
• US123622672025

  Electronic Package and Method for Manufacturing an Electronic Package

  SKYWORKS SOLUTIONS, Inc.

  0 cites
• US122611272025

  Application of Conductive via or Trench for Intra Module EMI Shielding

  SKYWORKS SOLUTIONS, Inc.

  0 cites
• US120588062024

  Devices and Methods Related to Metallization of Ceramic Substrates for Shielding Applications

  Skyworks Solutions, Inc.

  0 cites
• US120339542024

  Packaged Module with Ball Grid Array and Grounding Pins for Signal Isolation, Method of Manufacturing the Same, and Wireless Device Comprising the Same

  Skyworks Solutions, Inc.

  0 cites
• US119618052024

  Devices and Methods Related to Dual-sided Radio-frequency Package with Overmold Structure

  Skyworks Solutions, Inc.

  0 cites
• US118943232024

  Devices Related to Dual-sided Module with Land-grid Array (LGA) Footprint

  Skyworks Solutions, Inc.

  0 cites
• US116825852023

  Devices for Fabrication of Shielded Modules

  Skyworks Solutions, Inc.

  0 cites