Patents/Inventors

Hope Chiu

ShanghaiCN13 patents

10 Patents

US126223062026
Semiconductor Device with Optimized Underfill Flow
SANDISK TECHNOLOGIES, Inc.
0 cites
US124827612025
Semiconductor Device Package Having Improved Conductive Stub Coverage
SANDISK TECHNOLOGIES, Inc.
0 cites
US123478102025
Semiconductor Device Package Die Stacking System and Method
Western Digital Technologies, Inc.
0 cites
US120626252024
Semiconductor Device Package Mold Flow Control System and Method
SANDISK TECHNOLOGIES, Inc.
0 cites
US120274972024
Semiconductor Device with Unbalanced Die Stackup
Western Digital Technologies, Inc.
0 cites
US120210602024
Reducing Keep-out-zone Area for a Semiconductor Device
Western Digital Technologies, Inc.
0 cites
US120210612024
Packaged Memory Device with Flip Chip and Wire Bond Dies
Western Digital Technologies, Inc.
0 cites
US119424592024
Semiconductor Device Package with Exposed Bond Wires
Western Digital Technologies, Inc.
0 cites
US118374762023
Flip-chip Package with Reduced Underfill Area
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites
US118108962023
Substrate Component Layout and Bonding Method for Increased Package Capacity
Western Digital Technologies, Inc.
0 cites