10 Patents
- US123175822025Integrated Circuit Devices Including a Metal Resistor and Methods of Forming the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122438202025Semiconductor Device with Fine Metal Lines for BEOL Structure and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122305712025Integrated Circuit Devices Including a Power Rail and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US122180542025Method of Forming an Integrated Circuit Device Having an Etch-stop Layer Between Metal Wires
Samsung Electronics Co., Ltd.
0 cites - US121425642024Backside Power Distribution Network Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121257882024Through Silicon Buried Power Rail Implemented Backside Power Distribution Network Semiconductor Architecture and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US119904092024Semiconductor Device with Fine Metal Lines for BEOL Structure and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118814552024Through Silicon Buried Power Rail Implemented Backside Power Distribution Network Semiconductor Architecture and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US117697282023Backside Power Distribution Network Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites