Hongyu Tian

2 Patents

• US125315872026

  Communication Chip

  RDA Microelectronics (Beijing) Co., Ltd.

  0 cites
• US120026012024

  Stress-resistant, Creep-resistant, High-temperature Resistant and High-insulation Sheath Material for Maglev Train Cable, and Manufacturing Method and Use Thereof

  Anhui Jianzhu University

  0 cites