Hongki Moon

12 Patents

• US126157432026

  Electronic Device Comprising Thermal Management Chamber Using Boiling

  Samsung Electronics Co., Ltd.

  0 cites
• US125609612026

  Heat Dissipation Structure and Electronic Device Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US125404022026

  Electronic Device Including Outer Housing Plated with Conductive Member and Manufacturing Method Therefor

  INTOPS. CO., Ltd

  0 cites
• US125015922025

  Electronic Device Comprising Thermal Diffusion Member

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124498662025

  Electronic Device Having Thermal Diffusion Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US122043842025

  Electronic Device Including Heat Dissipation Structure

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US119105162024

  Electronic Device Including Heat Dissipation Structure

  Samsung Electronics Co., Ltd

  0 cites
• US118957672024

  Electronic Device Filled with Phase Change Material Between Plurality of Circuit Boards Connected by Connecting Members

  Samsung Electronics Co., Ltd

  0 cites
• US118816122024

  Heat Dissipation Sheet and Electronic Device Including Same

  Amotech Co., Ltd.

  0 cites
• US118715412024

  Electronic Device Including Vapor Chamber

  Samsung Electronics Co., Ltd.

  0 cites
• US117359362023

  Wireless Charging Device

  Samsung Electronics Co., Ltd.

  0 cites
• US117144682023

  Electronic Device Having Thermal Diffusion Structure

  Samsung Electronics Co., Ltd

  0 cites