Hong-ye Shih

3 Patents

• US123226802025

  Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120516722024

  Package Structure and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118239792023

  Method of Forming Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites