Hong-wei Chan

8 Patents

• US125754092026

  Interconnect Level with High Resistance Layer and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US122306032025

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121425742024

  Semiconductor Devices and Methods of Manufacture

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US120949302024

  Integrated Circuit Structure and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120741072024

  Structure and Method of Forming a Semiconductor Device with Resistive Elements

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US119232952024

  Interconnect Level with High Resistance Layer and Method of Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US119088292024

  Integrated Circuit Package and Method of Forming Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117569242023

  Method of Fabricating a Semiconductor Chip Having Strength Adjustment Pattern in Bonding Layer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites