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Hong Seung Yeon
Chandler, AZ
US
4 patents
3 Patents
US12593695
2026
Structure and Process for Warpage Reduction
INTEL CORPORATION
0 cites
US12557594
2026
Device and Method for Real-time Offset Adjustment of a Semiconductor Die Placement
Intel Corporation
0 cites
US12400363
2025
Device and Method for Improved Fiducial Marker Detection
Intel Corporation
0 cites