Patents/Inventors

Hong-hai Dai

SuzhouCN2 patents

3 Patents

US120893462024
Die Package Structure and Method for Fabricating the Same
REALTEK SEMICONDUCTOR Corp.
0 cites
US118707742024
Method and System for Authentication Data Transmission
REALTEK SEMICONDUCTOR Corp.
0 cites
US116406582023
Multi-path Image Processing Apparatus and Method
REALTEK SEMICONDUCTOR CORPORATION
0 cites