Hong-da Chang

4 Patents

• US121258282024

  Carrying Substrate, Electronic Package Having the Carrying Substrate, and Methods for Manufacturing the Same

  SILICONWARE PRECISION INDUSTRIES CO., Ltd.

  0 cites
• US119233372024

  Carrying Substrate, Electronic Package Having the Carrying Substrate, and Methods for Manufacturing the Same

  SILICONWARE PRECISION INDUSTRIES CO., Ltd.

  0 cites
• US116768772023

  Electronic Package with Multiple Electronic Components Spaced Apart by Grooves

  Siliconware Precision Industries Co., Ltd.

  0 cites
• US116005712023

  Electronic Package, Packaging Substrate, and Methods for Fabricating the Same

  Siliconware Precision Industries Co., Ltd

  0 cites