Patents/Inventors

Hong-chi Yu

KaohsiungTW7 patents

4 Patents

US125688472026
Chip Package and Method of Manufacturing the Same
WALTON ADVANCED ENGINEERING, Inc.
0 cites
US125327602026
Chip Package Unit, Method of Manufacturing the Same, and Package Structure Formed by Stacking the Same
WALTON ADVANCED ENGINEERING, Inc.
0 cites
US125124482025
Multi-layer Stacked Chip Package
WALTON ADVANCED ENGINEERING, Inc.
0 cites
US124827712025
Chip Package with Higher Bearing Capacity in Wire Bonding
WALTON ADVANCED ENGINEERING, Inc.
0 cites