Hong-chen Cheng

4 Patents

• US123083032025

  Integrated Circuit Die with Memory Macro Including Through-silicon via and Method of Forming the Same

  TSMC NANJING COMPANY, LIMITED

  0 cites
• US118549432023

  Memory Macro Including Through-silicon Via

  TSMC NANJING COMPANY, LIMITED

  0 cites
• US117231952023

  Semiconductor Device Having an Inter-layer via (ILV), and Method of Making Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US115629462023

  Memory Macro Including Through-silicon Via

  TSMC NANJING COMPANY, LIMITED

  0 cites