Patents/Inventors

Hong Bok We

San Diego, CAUS36 patents

35 Patents

US126223132026
Metal Pocket Fanout Package
QUALCOMM INCORPORATED
0 cites
US125819662026
Electronic Component Placed on Core of Substrate
QUALCOMM INCORPORATED
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US125435992026
Package Comprising a First Substrate, a Second Substrate and an Electrical Device Coupled to a Bottom Surface of the Second Substrate
QUALCOMM INCORPORATED
0 cites
US125001462025
Substrate(s) for an Integrated Circuit (IC) Package Employing a Metal Core for Improved Electrical Shielding and Structural Strength, and Related IC Packages and Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US124245592025
Package with a Substrate Comprising Embedded Escape Interconnects and Surface Escape Interconnects
QUALCOMM INCORPORATED
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US123811742025
Integrated Circuit (IC) Packages Employing Wire Bond Channel Over Package Substrate, and Related Fabrication Methods
QUALCOMM INCORPORATED
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US122438552025
Package Comprising Channel Interconnects Located Between Solder Interconnects
QUALCOMM INCORPORATED
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US122305522025
Recess Structure for Padless Stack Via
QUALCOMM INCORPORATED
0 cites
US121006452024
Integrated Circuit (IC) Package Employing Added Metal for Embedded Metal Traces in Ets-based Substrate for Reduced Signal Path Impedance, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US120210632024
Circular Bond Finger Pad
QUALCOMM INCORPORATED
0 cites
US119554092024
Substrate Comprising Interconnects in a Core Layer Configured for Skew Matching
QUALCOMM INCORPORATED
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US119488772024
Hybrid Package Apparatus and Method of Fabricating
QUALCOMM INCORPORATED
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US118323912023
Terminal Connection Routing and Method the Same
QUALCOMM INCORPORATED
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US118239832023
Package with a Substrate Comprising Pad-on-pad Interconnects
QUALCOMM INCORPORATED
0 cites
US118173652023
Thermal Mitigation Die Using Back Side Etch
QUALCOMM INCORPORATED
0 cites
US118046452023
Multi-sided Antenna Module Employing Antennas on Multiple Sides of a Package Substrate for Enhanced Antenna Coverage, and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US117913202023
Integrated Circuit (IC) Packages Employing a Package Substrate with a Double Side Embedded Trace Substrate (ETS), and Related Fabrication Methods
QUALCOMM INCORPORATED
0 cites
US117912762023
Package Comprising Passive Component Between Substrates for Improved Power Distribution Network (PDN) Performance
QUALCOMM INCORPORATED
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US117841512023
Redistribution Layer Connection
QUALCOMM INCORPORATED
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US117768882023
Package with a Substrate Comprising Protruding Pad Interconnects
QUALCOMM INCORPORATED
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US117496112023
Package with a Substrate Comprising Periphery Interconnects
QUALCOMM INCORPORATED
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US117495792023
Thermal Structures Adapted to Electronic Device Heights in Integrated Circuit (IC) Packages
QUALCOMM INCORPORATED
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US117156882023
Variable Dielectric Constant Materials in Same Layer of a Package
QUALCOMM INCORPORATED
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US116826072023
Package Having a Substrate Comprising Surface Interconnects Aligned with a Surface of the Substrate
QUALCOMM INCORPORATED
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US116583912023
Antenna Module
QUALCOMM INCORPORATED
0 cites
US116055952023
Packages with Local High-density Routing Region Embedded Within an Insulating Layer
QUALCOMM INCORPORATED
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US115944912023
Multi-die Interconnect
QUALCOMM INCORPORATED
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US115812622023
Package Comprising a Die and Die Side Redistribution Layers (RDL)
QUALCOMM INCORPORATED
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US115812512023
Package Comprising Inter-substrate Gradient Interconnect Structure
QUALCOMM INCORPORATED
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US115629622023
Package Comprising a Substrate and Interconnect Device Configured for Diagonal Routing
QUALCOMM INCORPORATED
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US115519392023
Substrate Comprising Interconnects Embedded in a Solder Resist Layer
QUALCOMM INCORPORATED
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US115520152023
Substrate Comprising a High-density Interconnect Portion Embedded in a Core Layer
QUALCOMM INCORPORATED
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US115454252023
Substrate Comprising Interconnects Embedded in a Solder Resist Layer
QUALCOMM INCORPORATED
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US115454352023
Double Sided Embedded Trace Substrate
QUALCOMM INCORPORATED
0 cites
US115454392023
Package Comprising an Integrated Device Coupled to a Substrate Through a Cavity
QUALCOMM INCORPORATED
0 cites