15 Patents
- US126047192026Semiconductor Device Having a Through-via Structure Electrically Connected to a Contact Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125120472025Driving Circuit Board, Electronic Apparatus Including Driving Circuit Board, and Method of Fabricating Electronic Apparatus
FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION
0 cites - US124889402025Electronic Device Including Dielectric Layer and Method of Manufacturing the Electronic Device
Samsung Electronics Co., Ltd.
0 cites - US123410842025Integrated Circuit Device with Through-electrode and Electrode Landing Pad, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US122373912025Semiconductor Device Including a Field Effect Transistor and a Method of Fabricating the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121655712024Driving Circuit Board, Electronic Apparatus Including Driving Circuit Board, and Method of Fabricating Electronic Apparatus
FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION
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