Patents/Inventors

Ho-chuan Lin

TaichungTW9 patents

11 Patents

US125001452025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US123680812025
Electronic Package Comprising Conductive Layer Connected Electrode Pad Through Electronic Component
Siliconware Precision Industries Co., Ltd.
0 cites
US123344252025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US122939522025
Electronic Package and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121006332024
Electronic Package Comprising Wire Inside an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US121006482024
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120682112024
Electronic Package Comprising Multiple Wires Inside an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120277532024
Electronic Package and Antenna Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US120149672024
Manufacturing Method of Electronic Package Comprising a Wire Within an Electronic Component
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117768972023
Electronic Module, Manufacturing Method Thereof and Electronic Package Having the Same
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US117282342023
Electronic Package Comprising Wire Inside an Electronic Component and Manufacturing Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites