Patents/Inventors

Hisashi Suda

TokyoJP1 patent

2 Patents

US121348142024
Cu—ni—si-based Copper Alloy Sheet Material, Method for Producing Same, and Current-carrying Component
DOWA METALTECH CO., Ltd.
0 cites
US119461292024
Cu—ni—al Based Copper Alloy Sheet Material, Method for Producing Same, and Conductive Spring Member
DOWA METALTECH CO., Ltd.
0 cites