Hisao Gonohe

2 Patents

• US123198072025

  Resin Composition and Molded Product

  DOW-MITSUI POLYCHEMICALS CO., Ltd.

  0 cites
• US118980652024

  Resin Composition for Sealant, Laminate, Packaging Material, and Package

  DOW-MITSUI POLYCHEMICALS CO., Ltd.

  0 cites