Hiroyuki Uchiuzou

3 Patents

• US124733092025

  Organometallic Compound and Method of Manufacturing Integrated Circuit Using the Same

  ADEKA CORPORATION

  0 cites
• US124102032025

  Organometallic Adduct Compound and Method of Manufacturing Integrated Circuit Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US117461212023

  Molybdenum Compound and Method of Manufacturing Integrated Circuit Device Using the Same

  ADEKA CORPORATION

  0 cites