Patents/Inventors

Hiroyuki Mori

TokyoJP31 patents

28 Patents

US126222842026
Solder Volume for Flip-chip Bonding
International Business Machines Corporation
0 cites
US124516992025
Energy Supply Plan Formulation Device and Energy Supply Plan Formulation Method
MITSUBISHI ELECTRIC CORPORATION
0 cites
US123858512025
Management System, Management Device, Management Method, and Program
OMRON CORPORATION
0 cites
US123851102025
Pure Copper Plate
MITSUBISHI MATERIALS CORPORATION
0 cites
US123640442025
Solid-state Imaging Apparatus and Electronic Apparatus
Sony Semiconductor Solutions Corporation
0 cites
US123592842025
Copper Alloy, Plastically Worked Copper Alloy Material, Component for Electronic/electrical Equipment, Terminal, Heat Dissipation Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US123424552025
Layer-to-layer Registration Measurement Mark
International Business Machines Corporation
0 cites
US123313862025
Pure Copper Plate
MITSUBISHI MATERIALS CORPORATION
0 cites
US122414962025
Member for Fastening and Method of Manufacturing Same
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites
US122031582025
Copper Alloy, Copper Alloy Plastic Working Material, Component for Electronic/electrical Device, Terminal, Bus Bar, Lead Frame, and Heat Dissipation Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US121733822024
Combustion Ash Handling Method and System, and Petroleum-based Fuel Combustion Plant
KAWASAKI JUKOGYO KABUSHIKI KAISHA
0 cites
US121426032024
Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites
US121273422024
Metal Base Substrate, Electronic Component Mounting Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US121070972024
Solid-state Imaging Device and Electronic Apparatus
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
0 cites
US120875962024
Controlling of Height of High-density Interconnection Structure on Substrate
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US120354692024
Pure Copper Plate, Copper/ceramic Bonded Body, and Insulated Circuit Board
MITSUBISHI MATERIALS CORPORATION
0 cites
US118880082024
Solid-state Imaging Apparatus and Electronic Apparatus
Sony Semiconductor Solutions Corporation
0 cites
US117955252023
Copper Alloy Plate, Copper Alloy Plate with Plating Film, and Manufacturing Method Thereof
MITSUBISHI MATERIALS CORPORATION
0 cites
US117912702023
Direct Bonded Heterogeneous Integration Silicon Bridge
International Business Machines Corporation
0 cites
US117355292023
Side Pad Anchored by Next Adjacent Via
International Business Machines Corporation
0 cites
US117355752023
Bonding of Bridge to Multiple Semiconductor Chips
International Business Machines Corporation
0 cites
US117323292023
Copper Alloy, Copper Alloy Plastic-processed Material, Component for Electronic and Electric Devices, Terminal, Bus Bar, and Heat-diffusing Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US117252582023
Copper Alloy for Electronic/electrical Devices, Copper Alloy Planar Bar Stock for Electronic/electrical Devices, Component for Electronic/electrical Devices, Terminal and Bus Bar
MITSUBISHI MATERIALS CORPORATION
0 cites
US116600262023
Restoring a Wearable Biological Sensor
International Business Machines Corporation
0 cites
US116555232023
Copper Alloy for Electronic/electric Device, Copper Alloy Sheet/strip Material for Electronic/electric Device, Component for Electronic/electric Device, Terminal, and Busbar
MITSUBISHI MATERIALS CORPORATION
0 cites
US116521152023
Solid-state Imaging Device and Electronic Apparatus
Sony Semiconductor Solutions Corporation
0 cites
US115724602023
Thermoplastic Elastomer for Carbon Fiber Reinforced Plastic Bonding Lamination
MCPP Innovation LLC
0 cites
US115748172023
Fabricating an Interconnection Using a Sacrificial Layer
International Business Machines Corporation
0 cites