Hiroyuki Matsuyama

4 Patents

• US123516842025

  Polyimide Resin Precursor, Polyimide Resin, Metal-clad Laminated Board, Laminate, and Flexible Printed Wiring Board

  Arisawa MFG. Co., Ltd.

  0 cites
• US119761712024

  Polyimide Resin Precursor, Polyimide Resin, Metal-clad Laminated Board, Laminate, and Flexible Printed Wiring Board

  Arisawa MFG. Co., Ltd.

  0 cites
• US119461432024

  Laminate

  Arisawa Mfg. Co., Ltd.

  0 cites
• US117608382023

  Polyimide Resin Precursor

  Arisawa Mfg. Co., Ltd.

  0 cites