Patents/Inventors

Hiroyuki Kurihara

TokyoJP1 patent

2 Patents

US124128592025
Via Wiring Formation Substrate, Manufacturing Method for via Wiring Formation Substrate, and Semiconductor Device Mounting Component
SAN-EI KAGAKU CO., Ltd.
0 cites
US122011312025
Aquatic Organism Growth Promotor
Toray Industries, Inc.
0 cites