3 Patents
- US124214352025Adhesive Composition for Flexible Printed-wiring Board (FPC), and Heat-curable Resin Film, Prepreg and FPC Substrate Containing Same
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites - US121460572024Cyclic Imide Resin Composition, Prepreg, Copper-clad Laminate and Printed-wiring Board
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites - US116084382023Low-dielectric Heat Dissipation Film Composition and Low-dielectric Heat Dissipation Film
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites