Hiroyuki Fujisawa

4 Patents

• US125345842026

  Resin Composition, Prepreg, Resin-attached Film, Resin-attached Metal Foil, Metal-cladded Laminate Sheet, and Wiring Board

  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.

  0 cites
• US122865002025

  Resin Composition, Prepreg, Resin-equipped Film, Resin- Equipped Metal Foil, Metal-clad Laminate, and Wiring Board

  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.

  0 cites
• US121838192024

  Silicon Carbide Semiconductor Device

  FUJI ELECTRIC CO., Ltd.

  0 cites
• US116109902023

  Silicon Carbide Semiconductor Device

  FUJI ELECTRIC CO., Ltd.

  0 cites