Patents/Inventors

Hirotaka Taniguchi

OgakiJP1 patent

2 Patents

US122322682025
Wiring Substrate and Method for Manufacturing Wiring Substrate
IBIDEN CO., Ltd.
0 cites
US115880892023
Printed Wiring Board Having Thermoelectric Emlement Accommodatred Therein
IBIDEN CO., Ltd.
0 cites