Patents/Inventors

Hirotaka Miyano

KariyaJP2 patents

3 Patents

US124009232025
Semiconductor Package, Electronic Device, and Method for Manufacturing Semiconductor Package
DENSO CORPORATION
0 cites
US122215652025
Bonded Structure
DENSO CORPORATION
0 cites
US121040992024
Bonded Structure and Method for Producing Same
DENSO CORPORATION
0 cites