Hirotaka Matsunaga

10 Patents

• US123592842025

  Copper Alloy, Plastically Worked Copper Alloy Material, Component for Electronic/electrical Equipment, Terminal, Heat Dissipation Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US123313862025

  Pure Copper Plate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US122813762025

  Slit Copper Material, Part for Electric/electronic Device, Bus Bar, Heat Dissipation Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US122636882025

  Recording Device and Recording Method

  Seiko Epson Corporation

  0 cites
• US122031582025

  Copper Alloy, Copper Alloy Plastic Working Material, Component for Electronic/electrical Device, Terminal, Bus Bar, Lead Frame, and Heat Dissipation Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US120838072024

  Printing Apparatus and Printing Method

  Seiko Epson Corporation

  0 cites
• US120354692024

  Pure Copper Plate, Copper/ceramic Bonded Body, and Insulated Circuit Board

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US117323292023

  Copper Alloy, Copper Alloy Plastic-processed Material, Component for Electronic and Electric Devices, Terminal, Bus Bar, and Heat-diffusing Substrate

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US117252582023

  Copper Alloy for Electronic/electrical Devices, Copper Alloy Planar Bar Stock for Electronic/electrical Devices, Component for Electronic/electrical Devices, Terminal and Bus Bar

  MITSUBISHI MATERIALS CORPORATION

  0 cites
• US116555232023

  Copper Alloy for Electronic/electric Device, Copper Alloy Sheet/strip Material for Electronic/electric Device, Component for Electronic/electric Device, Terminal, and Busbar

  MITSUBISHI MATERIALS CORPORATION

  0 cites