Patents/Inventors

Hiroshi Okada

TokyoJP4 patents

5 Patents

US125015822025
Vapor Chamber
Furukawa Electric Co., Ltd.
0 cites
US124475642025
Solder Alloy, Solder Ball, and Solder Joint
Senju Metal Industry Co., Ltd.
0 cites
US120784232024
Vapor Chamber with Multilayer Wick
Furukawa Electric Co., Ltd.
0 cites
US118726562024
Core Material, Electronic Component and Method for Forming Bump Electrode
SENJU METAL INDUSTRY CO., Ltd.
0 cites
US118235072023
Recording Device, Recording Method, and Computer Program
SONY CORPORATION
0 cites