Patents/Inventors

Hironori Shimada

ToyamaJP3 patents

4 Patents

US124566362025
Heat Insulation Structure, Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Substrate Processing Method
Kokusai Electric Corporation
0 cites
US119357622024
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Recording Medium
KOKUSAI ELECTRIC CORPORATION
0 cites
USD10175612024
Nozzle Holder of Substrate Processing Apparatus
KOKUSAI ELECTRIC CORPORATION
0 cites
US115552462023
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Kokusai Electric Corporation
0 cites