Hiroki Awata

3 Patents

• US120804832024

  Method of Producing Multilayer Ceramic Electronic Component, and Multilayer Ceramic Electronic Component

  MURATA MANUFACTURING CO., Ltd.

  0 cites
• US120515472024

  Component Built-in Substrate Including Multilayer Ceramic Electronic Component Including Protruding Connection Portions

  MURATA MANUFACTURING CO., Ltd.

  0 cites
• US116461572023

  Component Built-in Substrate

  MURATA MANUFACTURING CO., Ltd.

  0 cites