Patents/Inventors

Hirokazu Komori

OsakaJP17 patents

17 Patents

US126092162026
Multi-core Cable, and Disconnection Detection Device
Autonetworks Technologies, Ltd.
0 cites
US125737902026
Connector-equipped Electrical Wire and Connector Housing
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US124629522025
Cable with Abnormality Precursor Detection Function and Electric Wire Abnormality Precursor Detection Device
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US123081412025
Wiring Module and Elastic Waterproofing Member
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US122967632025
Wiring Module
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US122967642025
Wiring Module
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US122679542025
Fluororesin Composition, Fluororesin Sheet, Laminate and Substrate for Circuits
DAIKIN INDUSTRIES, Ltd.
0 cites
US122614242025
Fixing Structure of Wiring Member and Wiring Member
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US121725892024
Door Component, Grommet, and Wiring Module
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US121424002024
Wiring Module and Elastic Waterproofing Member
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US121288342024
Wiring Member
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US121261562024
Fixing Structure of Wiring Member, and Wiring Member with Joint Member
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US120342852024
Hot Melt Block, Cable Manufacturing Method, and Cable
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites
US119632972024
Fluororesin Composition, Fluororesin Sheet, Laminate and Substrate for Circuits
DAIKIN INDUSTRIES, Ltd.
0 cites
US119394502024
Resin Composition for Circuit Board, Molded Body for Circuit Board, Layered Body for Circuit Board, and Circuit Board
DAIKIN INDUSTRIES, Ltd.
0 cites
US118665702024
Molding Powder
DAIKIN INDUSTRIES, Ltd.
0 cites
US115550982023
Molding Powder
DAIKIN INDUSTRIES. Ltd.
0 cites