Hinmeng Au

3 Patents

• US121130262024

  Multi-chip Package and Method of Providing Die-to-die Interconnects in Same

  Intel Corporation

  0 cites
• US118760532024

  Multi-chip Package and Method of Providing Die-to-die Interconnects in Same

  Intel Corporation

  0 cites
• US118240082023

  Multi-chip Package and Method of Providing Die-to-die Interconnects in Same

  Intel Corporation

  0 cites