Patents/Inventors

Hikari Murai

TokyoJP1 patent

2 Patents

US119305942024
Adhesive Film for Multilayer Printed-wiring Board
RESONAC CORPORATION
0 cites
US117807352023
Aerogel Composite, and Supporting Member and Heat Insulation Material Provided with Aerogel Composite
RESONAC CORPORATION
0 cites