Patents/Inventors

Hideyo Osanai

TokyoJP3 patents

4 Patents

US123005122025
Metal/ceramic Bonding Substrate and Method for Producing Same
DOWA METALTECH CO., Ltd.
0 cites
US122213892025
Aluminum/ceramic Bonding Substrate and Method for Producing Same
Mitsubishi Electric Corporation
0 cites
US121453522024
Metal/ceramic Bonding Substrate and Method for Producing Same
DOWA METALTECH CO, Ltd.
0 cites
US119192882024
Method for Producing Heat Radiation Member
DOWA METALTECH CO., Ltd.
0 cites