Patents/Inventors

Hideya Kawasaki

SuitaJP3 patents

2 Patents

US125346512026
Electrically Conductive Adhesive, Sintered Body of Electrically Conductive Adhesive, Method for Producing Sintered Body, Electronic Component, and Method for Producing Electronic Component
Osaka Soda Co., Ltd.
0 cites
US117674432023
Copper Particle Mixture and Method for Manufacturing Same, Copper Particle Mixture Dispersion, Ink Containing Copper Particle Mixture, Method for Storing Copper Particle Mixture, and Method for Sintering Copper Particle Mixture
THE SCHOOL CORPORATION KANSAI UNIVERSITY
0 cites