Patents/Inventors

Hidetaka Oshio

TokyoJP2 patents

3 Patents

US121835782024
Method for Forming and Patterning a Layer And/or Substrate
Applied Materials, Inc.
0 cites
US121129492024
Highly Etch Selective Amorphous Carbon Film
Applied Materials, Inc.
0 cites
US120149272024
Highly Etch Selective Amorphous Carbon Film
Applied Materials, Inc.
0 cites