Patents/Inventors

Hideshi Okada

OsakaJP2 patents

3 Patents

US124425722025
Heat Pump
YANMAR POWER TECHNOLOGY CO., Ltd.
0 cites
US122283152025
Heat Pump
YANMAR POWER TECHNOLOGY CO., Ltd.
0 cites
US119358192024
Circuit Module Having a Plurality of Lead Frames Connected to a Substrate by Metal Posts
MURATA MANUFACTURING CO., Ltd.
0 cites