Patents/Inventors

Hideo Nakako

TokyoJP9 patents

8 Patents

US125648792026
Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body
RESONAC CORPORATION
0 cites
US125448322026
Copper Paste, Wick Formation Method, and Heat Pipe
Resonac Corporation
0 cites
US123549142025
Method for Producing Substrate Having Through-silicon Vias, Substrate Having Through-silicon Vias, and Copper Paste for Through-silicon via Formation
Resonac Corporation
0 cites
US122334602025
Copper Paste, Wick Formation Method, and Heat Pipe
Resonac Corporation
0 cites
US120708002024
Electronic Component and Method for Manufacturing Electronic Component
RESONAC CORPORATION
0 cites
US118906812024
Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste
RESONAC CORPORATION
0 cites
US118879602024
Member Connection Method
RESONAC CORPORATION
0 cites
US115750762023
Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module
Showa Denko Materials Co., Ltd.
0 cites