Patents/Inventors

Hideo Nakagawa

OmihachimanJP2 patents

2 Patents

US125840502026
Adhesive Composition and Film-shaped Sealing Material
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US123424672025
Microstructure-transfer Apparatus, Stamp Head Unit, Stamp Component for Transferring Microstructure, and Method for Transferring Microstructure-integrated Component
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites