Patents/Inventors

Hideki Kono

OsakaJP4 patents

5 Patents

US124485142025
Resin Composition and Molded Article
DAIKIN INDUSTRIES, Ltd.
0 cites
US121988342025
Resin Composition and Moulded Article
DAIKIN INDUSTRIES, Ltd.
0 cites
US121803582024
Fluorine-containing Resin Composition and Method for Production Thereof
DAIKIN INDUSTRIES, Ltd.
0 cites
US119394502024
Resin Composition for Circuit Board, Molded Body for Circuit Board, Layered Body for Circuit Board, and Circuit Board
DAIKIN INDUSTRIES, Ltd.
0 cites
US117392062023
Resin Composition and Molded Article
DAIKIN INDUSTRIES, Ltd.
0 cites