Hideki Horita

4 Patents

• US125639812026

  Method of Processing Substrate, Substrate Processing Apparatus, Recording Medium, and Method of Manufacturing Semiconductor Device

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US123810792025

  Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Recording Medium and Method of Processing Substrate

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US123410002025

  Substrate Processing Apparatus and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US115877882023

  Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium

  KOKUSAI ELECTRIC CORPORATION

  0 cites