Patents/Inventors

Hidekazu Nakayama

TokyoJP5 patents

4 Patents

US125946402026
Grinding Method for Slice Wafer
DISCO CORPORATION
0 cites
US124069602025
Method of Manufacturing Laminate by Sinter- Bonding Semiconductor Chip and Substrate
LINTEC CORPORATION
0 cites
US122887682025
Method of Manufacturing Laminate
LINTEC CORPORATION
0 cites
US119488652024
Film-shaped Firing Material and Film-shaped Firing Material with a Support Sheet
LINTEC CORPORATION
0 cites